Cover window for display device and manufacturing method thereof

ABSTRACT

A cover window for a display device and a method of manufacturing the same are provided. The cover window for a display device includes a light-transmitting substrate, a mold layer on at least a part of an edge of the light-transmitting substrate, and having an uneven pattern formed on a surface thereof, an inorganic material pattern layer on the mold layer and exposing a portion of the mold layer, and a print layer on the mold layer and covering the exposed portion of the mold layer.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.16/117,428, filed Aug. 30, 2018, which claims priority to and thebenefit of Korean Patent Application No. 10-2017-0114053, filed Sep. 6,2017, the entire content of both of which is incorporated herein byreference.

BACKGROUND 1. Field

Embodiments of the present invention relate to a cover window for adisplay device and a manufacturing method thereof.

2. Description of the Related Art

A display device is a device that displays an image using an organiclight emitting element, a liquid crystal element, or the like. Thedisplay device is applied to TVs, monitors, notebooks, tablet PCs,mobile phones, and the like.

The display device may include a cover window for protecting a displaypanel. Mobile phones and tablet PCs are easily exposed to externalenvironments because they can be used while being mobile, and alsobecause they continuously receive external forces when a touch functionis added. Therefore, the function of a cover window is more important.

Generally, the back surface of the cover window may be provided withpatterns for allowing the non-display area of the cover window to bereflective, metallic, or glossy. For example, when a resin layer havinga concavo-convex pattern on its surface and a layer formed by depositingan inorganic material are disposed together, reflective or glossyproperties can be realized.

However, an offset in which the sizes of the resin layer and thedeposition layer do not coincide with each other may occur in an actualprocess of manufacturing the cover window. This may cause a golden bandto be visually recognized in the cover window, or may cause visibilityto be deteriorated in the cover window.

SUMMARY

Accordingly, to solve the above, an aspect of embodiments of the presentinvention provides a cover window for a display device, which canprevent a phenomenon in which a golden band is visually recognized or inwhich visibility is deteriorated.

However, aspects of embodiments of the present invention are notrestricted to the one set forth herein. The above and other aspects ofembodiments of the present invention will become more apparent to one ofordinary skill in the art to which embodiments of the present inventionpertain by referencing the detailed description given below.

According to one embodiment of the present invention, a cover window fora display device includes a light-transmitting substrate, a mold layeron at least a part of an edge of the light-transmitting substrate, andhaving an uneven pattern formed on a surface thereof, an inorganicmaterial pattern layer on the mold layer and exposing a portion of themold layer, and a print layer on the mold layer and covering the exposedportion of the mold layer.

The exposed portion may include a part of an inner side of the mold on aplane.

The print layer may cover at least a part of the inorganic materialpattern layer.

The print layer may completely cover the mold layer and the inorganicmaterial pattern layer.

An inner line of the print layer may overlap an inner line of the moldlayer on a plane.

The mold layer may be entirely located on a pair of opposite edges ofthe light-transmitting substrate.

A flat mold layer having only smooth surfaces may be on an edge of thelight-transmitting substrate, the edge not being provided thereon withthe patterned mold layer.

The print layer may be on all edges of the light-transmitting substrate.

The print layer may include a color for substantially blocking visiblelight.

The cover window may further include a masking print layer on theinorganic material pattern layer, and completely overlapping theinorganic material pattern layer.

The print layer may cover at least a part of the masking print layer.

According to another embodiment of the present invention, a method ofmanufacturing a cover window for a display device includes forming amold layer having an unevenly patterned surface on at least a part of anedge of a light-transmitting substrate, depositing an inorganic materialonto the light-transmitting substrate to form an inorganic materialdeposition layer covering the entire surface of the light-transmittingsubstrate and the mold layer, forming a first print layer on a part ofan area where the inorganic material deposition layer overlaps the moldlayer, etching the inorganic material deposition layer using the firstprint layer as a mask to form an inorganic material pattern layer fromwhich a portion where the first print layer is not formed is removed,and forming a second print layer covering a portion of the mold layerexposed by removing the inorganic material deposition layer.

The first print layer and the second print layer may be formed byprinting an ink having a color for substantially blocking visible light.

Forming the mold layer may include irradiating a photocurable resin withlight.

The mold layer may be formed only on a pair of corresponding edges ofthe light-transmitting substrate.

A mold layer having a flat surface may be on an edge of thelight-transmitting substrate, the edge not being provided thereon withthe mold layer.

The second print layer may be on all edges of the light-transmittingsubstrate.

Etching the inorganic material deposition layer may expose at least apart of an inner side of the mold layer on a plane.

The second print layer may cover at least a part of the first printlayer.

Forming the second print layer may include completely covering the moldlayer, the inorganic material pattern layer, and the first print layer.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects of embodiments of the present invention willbecome more apparent by describing in detail embodiments thereof withreference to the attached drawings, in which:

FIG. 1 is a plan view of a cover window for a display device accordingto an embodiment of the present invention;

FIG. 2 is a sectional view taken along the line II-II′ in FIG. 1;

FIGS. 3 to 5 are sectional views of cover windows for a display deviceaccording to other embodiments of the present invention;

FIG. 6 is a plan view of a cover window for a display device accordingto another embodiment of the present invention;

FIG. 7 is a sectional view taken along the line VII-VII′ in FIG. 6;

FIG. 8 is a sectional view of a cover window for a display deviceaccording to another embodiment of the present invention; and

FIGS. 9 to 14 are sectional views illustrating a process ofmanufacturing a cover window for a display device in a stepwise manneraccording to an embodiment of the present invention.

DETAILED DESCRIPTION

Features of the inventive concept and methods of accomplishing the samemay be understood more readily by reference to the following detaileddescription of embodiments and the accompanying drawings. Hereinafter,embodiments will be described in more detail with reference to theaccompanying drawings. The present invention, however, may be embodiedin various different forms, and should not be construed as being limitedto only the illustrated embodiments herein. Rather, these embodimentsare provided as examples so that this disclosure will be thorough andcomplete, and will fully convey the aspects and features of the presentinvention to those skilled in the art. Accordingly, processes, elements,and techniques that are not necessary to those having ordinary skill inthe art for a complete understanding of the aspects and features of thepresent invention may not be described. Unless otherwise noted, likereference numerals denote like elements throughout the attached drawingsand the written description, and thus, descriptions thereof will not berepeated. Further, parts not related to the description of theembodiments might not be shown to make the description clear. In thedrawings, the relative sizes of elements, layers, and regions may beexaggerated for clarity.

In the following description, for the purposes of explanation, numerousspecific details are set forth to provide a thorough understanding ofvarious embodiments. It is apparent, however, that various embodimentsmay be practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various embodiments.

It will be understood that, although the terms “first,” “second,”“third,” etc., may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.These terms are used to distinguish one element, component, region,layer or section from another element, component, region, layer orsection. Thus, a first element, component, region, layer or sectiondescribed below could be termed a second element, component, region,layer or section, without departing from the spirit and scope of thepresent invention.

Spatially relative terms, such as “beneath,” “below,” “lower,” “under,”“above,” “upper,” and the like, may be used herein for ease ofexplanation to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or in operation, in additionto the orientation depicted in the figures. For example, if the devicein the figures is turned over, elements described as “below” or“beneath” or “under” other elements or features would then be oriented“above” the other elements or features. Thus, the example terms “below”and “under” can encompass both an orientation of above and below. Thedevice may be otherwise oriented (e.g., rotated 90 degrees or at otherorientations) and the spatially relative descriptors used herein shouldbe interpreted accordingly. Similarly, when a first part is described asbeing arranged “on” a second part, this indicates that the first part isarranged at an upper side or a lower side of the second part without thelimitation to the upper side thereof on the basis of the gravitydirection.

It will be understood that when an element, layer, region, or componentis referred to as being “on,” “connected to,” or “coupled to” anotherelement, layer, region, or component, it can be directly on, connectedto, or coupled to the other element, layer, region, or component, or oneor more intervening elements, layers, regions, or components may bepresent. However, “directly connected/directly coupled” refers to onecomponent directly connecting or coupling another component without anintermediate component. Meanwhile, other expressions describingrelationships between components such as “between,” “immediatelybetween” or “adjacent to” and “directly adjacent to” may be construedsimilarly. In addition, it will also be understood that when an elementor layer is referred to as being “between” two elements or layers, itcan be the only element or layer between the two elements or layers, orone or more intervening elements or layers may also be present.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the presentinvention. As used herein, the singular forms “a” and “an” are intendedto include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises,” “comprising,” “have,” “having,” “includes,” and“including,” when used in this specification, specify the presence ofthe stated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof. As used herein, the term “and/or” includes anyand all combinations of one or more of the associated listed items.

As used herein, the term “substantially,” “about,” “approximately,” andsimilar terms are used as terms of approximation and not as terms ofdegree, and are intended to account for the inherent deviations inmeasured or calculated values that would be recognized by those ofordinary skill in the art. As used herein, the terms “use,” “using,” and“used” may be considered synonymous with the terms “utilize,”“utilizing,” and “utilized,” respectively. Also, the term “exemplary” isintended to refer to an example or illustration.

When a certain embodiment may be implemented differently, a specificprocess order may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order.

Various embodiments are described herein with reference to sectionalillustrations that are schematic illustrations of embodiments and/orintermediate structures. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Further, specific structural orfunctional descriptions disclosed herein are merely illustrative for thepurpose of describing embodiments according to the concept of thepresent disclosure. Thus, embodiments disclosed herein should not beconstrued as limited to the particular illustrated shapes of regions,but are to include deviations in shapes that result from, for instance,manufacturing. For example, an implanted region illustrated as arectangle will, typically, have rounded or curved features and/or agradient of implant concentration at its edges rather than a binarychange from implanted to non-implanted region. Likewise, a buried regionformed by implantation may result in some implantation in the regionbetween the buried region and the surface through which the implantationtakes place. Thus, the regions illustrated in the drawings are schematicin nature and their shapes are not intended to illustrate the actualshape of a region of a device and are not intended to be limiting.Additionally, as those skilled in the art would realize, the describedembodiments may be modified in various different ways, all withoutdeparting from the spirit or scope of the present disclosure.

The electronic or electric devices and/or any other relevant devices orcomponents according to embodiments of the present invention describedherein may be implemented utilizing any suitable hardware, firmware(e.g. an application-specific integrated circuit), software, or acombination of software, firmware, and hardware. For example, thevarious components of these devices may be formed on one integratedcircuit (IC) chip or on separate IC chips. Further, the variouscomponents of these devices may be implemented on a flexible printedcircuit film, a tape carrier package (TCP), a printed circuit board(PCB), or formed on one substrate. Further, the various components ofthese devices may be a process or thread, running on one or moreprocessors, in one or more computing devices, executing computer programinstructions and interacting with other system components for performingthe various functionalities described herein. The computer programinstructions are stored in a memory which may be implemented in acomputing device using a standard memory device, such as, for example, arandom access memory (RAM). The computer program instructions may alsobe stored in other non-transitory computer readable media such as, forexample, a CD-ROM, flash drive, or the like. Also, a person of skill inthe art should recognize that the functionality of various computingdevices may be combined or integrated into a single computing device, orthe functionality of a particular computing device may be distributedacross one or more other computing devices without departing from thespirit and scope of the embodiments of the present invention.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which the present invention belongs. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and/orthe present specification, and should not be interpreted in an idealizedor overly formal sense, unless expressly so defined herein.

FIG. 1 is a plan view of a cover window for a display device accordingto an embodiment of the present invention, and FIG. 2 is a sectionalview taken along the line II-II′ in FIG. 1.

Referring to FIG. 1, the cover window 1 for a display device includes afirst area A and a second area B one a plane. The second area B is onthe periphery of the first area A. As shown in FIG. 1, when the firstarea A is formed in a rectangular shape, the second area B may be on theouter side along the edge of the first area A.

The first area A may be a light-transmitting are capable of transmittingvisible light, and the second are B may be a light-blocking areasubstantially blocking the transmission of visible light. When the coverwindow 1 is coupled to a display panel, the first area A of the coverwindow 1 may be a display area where the image that is output from thedisplay panel is visually recognized, and the second area B may be anon-display area where the image is not visually recognized.

At an inner edge of the second area B, at least a part of a second printlayer 70 on a back surface of the cover window 1 can be seen from afront direction of the cover window 1. Unless otherwise describedherein, a “front surface” of the cover window 1 refers to a surface thatis visibly recognized in the drawing in the plan view, such as in FIG.1, and refers to a surface facing upward in the sectional view, such asin FIG. 2. The “back surface” refers to a surface that is opposite tothe front surface. Details of the second print layer 70 will bedescribed later.

A light-transmitting hole H may be formed in a part of the second areaB. The light-transmitting hole H may be an area corresponding to acamera module, an optical sensor, or the like, which may be incorporatedin the display device. The light-transmitting hole H may be an areawhere only the light-transmitting member of the cover window 1 islocated, and may be an area that has substantially the same structure asthe first area A. However, the present invention is not limited thereto,and the light-transmitting hole H may be a portion formed through, ordefined by, the cover window 1.

Hereinafter, a specific structure of the cover window 1 for a displaydevice will be described with reference to sectional views.

Referring to FIG. 2, the cover window 1 of a display device includes alight-transmitting substrate/transparent substrate 10, a mold layer 40on the back surface of the light-transmitting substrate 10, an inorganicmaterial pattern layer 50 on the mold layer 40, and a second print layer70 on the mold layer 40. The cover window 1 may further include anadhesive layer 20 and a film layer 30, which are disposed between thelight-transmitting substrate 10 and the mold layer 40, and a first printlayer 60 on the inorganic material pattern layer 50.

The second area B of the cover window 1 may be defined as an area wherethe mold layer 40, the inorganic material pattern layer 50, the firstprint layer 60, and the second print layer 70 are located.

The light-transmitting substrate 10 may be a base substrate capable ofsupporting the components of the cover window 1 by providing a spacewhere the mold layer 40, the inorganic material pattern layer 50, andthe like are on a back surface thereof.

The light-transmitting substrate 10 may be made of a transparentmaterial, such as glass, to enable the substantial transmission ofvisible light. However, the present invention is not limited thereto,and the light-transmitting substrate 10 may contain a transparentpolymer material, such as polyethylene terephthalate (PET) or polymethylmethacrylate (PMMA).

When the cover window 1 is coupled to the display panel, the lightprovided from the display panel can be transmitted upward from theback/lower surface of the light-transmitting substrate 10 with referenceto FIG. 2.

The adhesive layer 20 and the film layer 30 may be on the back surfaceof the light-transmitting substrate 10. The adhesive layer 20 may serveto attach and fix the film layer 30 to the light-transmitting substrate10, and the film layer 30 may be provided as a base surface on whichcomponents of the cover window 1 are located. Both the adhesive layer 20and the film layer 30 may be made of a light-transmitting material.

The adhesive layer 20 may include an optical clear adhesive (OCA) or anoptical clear resin (OCR). The optical clear adhesive (OCA) and theoptical clear resin (OCR) may be a pressure sensitive adhesive (PSA).However, the present invention is not limited thereto.

The film layer 30 may contain a transparent polymer material such aspolyethylene terephthalate or polymethyl methacrylate. However, thepresent invention is not limited thereto.

The mold layer 40 may be on the film layer 30. The mold layer 40 may beon at least a part of the edge of the cover window 1. FIGS. 1 and 2illustrate a case where the mold layer 40 is on the entire edge of thecover window 1. The mold layer 40 may be in an area substantiallycorresponding to the second area B.

Referring to FIG. 2, the mold layer 40 may be provided with an unevenpattern formed on a lower surface thereof. In an embodiment, the unevenpattern formed on the lower surface of the mold layer 40 may be ahair-line pattern that is visually recognized as a planar thin linepattern, but is not limited thereto.

The uneven pattern formed on the lower surface of the mold layer 40 mayserve to realize the reflective properties and gloss of the second areaB together with the inorganic material pattern layer 50 to be describedlater. The mold layer 40 may be a layer formed by photocuring aphotocurable resin.

The inorganic material pattern layer 50 may be on the mold layer 40. Theinorganic material pattern layer 50 may expose at least a part of themold layer 40. Therefore, the inorganic material pattern layer 50 andthe mold layer 40 might not completely overlap each other. FIG. 2illustrates a case where the inorganic material pattern layer 50 exposesa part (M) of the inner side (right side in FIG. 2) of the mold layer 40on a plane. That is, in the present embodiment, the inorganic materialpattern layer 50 is not on a part of the inner side of the mold layer 40by a margin (e.g., a predetermined margin) M, and thus, the inner sideof the mold layer 40 may protrude toward the inner side of the coverwindow 1 further than the inner side of the inorganic material patternlayer 50.

The inorganic material pattern layer 50 may contain an inorganicmaterial, such as a metal, a metal oxide, or a non-metal oxide. Theinorganic material pattern layer 50 may be a layer formed by depositingan inorganic material on the entire surface of the cover window 1, andby then etching the deposited inorganic material. In an embodiment, theinorganic material pattern layer 50 may be formed by a non-conductivevacuum metallization (NCVM) process, but is not limited thereto.

The inorganic material pattern layer 50 may be directly on one surfaceof the mold layer 40 to allow the second area B to have reflectiveproperties and gloss.

The first print layer 60 may be on the inorganic material pattern layer50. The first print layer 60 may be a masking print layer that can beused as an etching mask in the process of forming the inorganic materialpattern layer 50. Accordingly, the first print layer 60 may completelyoverlap the inorganic material pattern layer 50. That is, on a plane,the area of the first print layer 60 may be substantially the same asthe area of the inorganic material pattern layer 50.

The first print layer 60 may be a layer formed by printing an ink havinga color capable of substantially blocking the transmission of a visiblelight, such as black light or blue light. That is, the first print layer60 may be a light-blocking pattern layer. The first print layer 60 maybe formed by screen-printing such a light-blocking ink, but the presentinvention is not limited thereto.

The second print layer 70 may be on the mold layer 40. The second printlayer 70 may cover the exposed portion of the mold layer 40 because theinorganic material pattern layer 50 is not on the exposed portion of themold layer 40. Therefore, the exposed portion of the mold layer 40 maybe in direct contact with the second print layer 70.

Similarly, the second print layer 70 may be a layer formed by printingan ink having a color capable of substantially blocking the transmissionof a visible light such as black light or blue light. The inks of thefirst print layer 60 and the second print layer 70 may be the same ordifferent in color. However, the present invention is not limitedthereto.

When the inorganic material pattern layer 50 is also in an area wherethe mold layer 40 is not located, it can be visually recognized as agolden band at the front face of the cover window 1. If the inorganicmaterial pattern layer 50 does not entirely cover the mold layer 40,visibility may be deteriorated. To prevent such a phenomenon, the moldlayer 40 and the inorganic material pattern layer 50 may completelyoverlap each other. However, any one of the mold layer 40 and theinorganic material pattern layer 50 may be extended or shortened by amargin or offset in an actual process.

Accordingly, in the present embodiment, when forming the inorganicmaterial pattern layer 50, the inorganic material pattern layer 50 maybe intentionally formed to be narrower than the mold layer 40 by amargin (e.g., a predetermined margin) M, and the exposed portion of themold layer 40 may be covered with the second print layer 70. Thus, agolden band phenomenon, which otherwise occurs when only the inorganicmaterial pattern layer 50 is present, can be reduced or prevented, and aportion of the mold layer 40 that is not provided with the inorganicmaterial pattern layer 50, may be covered with the light-blocking secondprint layer 70 so as not to negatively affect visibility.

The second print layer 70, as shown in FIG. 2, may cover a part of thefirst print layer 60, and may also directly contact a part of the filmlayer 30. However, the present invention is not limited thereto, and thearrangement structure of the second print layer 70 may be modified, aswith other embodiments to be described later.

The above-described structure may be applied to the light-transmittinghole H and the second area B adjacent thereto. Similarly, through thisstructure, the golden band phenomenon and the deterioration ofvisibility can be prevented.

FIG. 3 is a sectional view of a cover window 2 for a display deviceaccording to another embodiment of the present invention.

The cover window 2 of FIG. 3 is the same as the cover window 1 of FIGS.1 and 2, except that a second print layer 71 covers the entire firstprint layer 60. Hereinafter, a redundant description will be omitted.

Referring to FIG. 3, the second print layer 71 may cover the entirefirst print layer 60, as opposed to only a part of the first print layer60. Thus, the second print layer 71 may completely cover the mold layer40 and the first print layer 60.

FIG. 4 is a sectional view of a cover window 3 for a display deviceaccording to another embodiment of the present invention.

The cover window 3 of FIG. 4 is the same as the cover window 1 of FIGS.1 and 2, except that an inner edge of a second printed layer 72 and aninner edge of the mold layer 40 are located on a straight line.Hereinafter, a redundant description will be omitted.

Referring to FIG. 4, the inner line of the second printed layer 72 andthe inner line of the mold layer 40 are aligned, or located on astraight line. In this case, the inner line of the second printed layer72 and the inner line of the mold layer 40 may substantially overlapeach other on the plane, or in a plan view.

FIG. 5 is a sectional view of a cover window 4 for a display deviceaccording to another embodiment of the present invention.

The cover window 4 of FIG. 5 is the same as the cover window 1 of FIGS.1 and 2, except that a second print layer 73 covers the entire firstprint layer 60 as shown in FIG. 3, and the inner line of the secondprint layer 73 and the inner line of the mold layer 40 are located on astraight line as shown in FIG. 4. Hereinafter, a redundant descriptionwill be omitted.

FIG. 6 is a plan view of a cover window 5 for a display device accordingto another embodiment of the present invention, and FIG. 7 is asectional view taken along the line VII-VII′ in FIG. 6.

The cover window 5 of FIGS. 6 and 7 is the same as the cover window 1 ofFIGS. 1 and 2, except that the mold layer 40, the inorganic materialpattern layer 50, and the first print layer 60 are only on a pair ofedges corresponding to each other of the cover window 5. Hereinafter, aredundant description will be omitted.

Referring to FIGS. 6 and 7, the mold layer 40, the inorganic materialpattern layer 50, and the first print layer 60 may be omitted from theleft and right edges of the second area B of the cover window 5. Thatis, the mold layer 40, the inorganic material pattern layer 50, and thefirst print layer 60 may instead be only on the upper and lower edges ofthe cover window 5. For example, only a second print layer 74 may be onthe left and right edges of the second area B to define the second areaB. Accordingly, only the upper and lower edges of the cover window 5 maybe configured to exhibit reflective properties or gloss. Because thesectional structure at the upper and lower edges of the cover window 5is substantially the same as that in FIGS. 1 and 2, a descriptionthereof will be omitted.

FIG. 8 is a sectional view of a cover window 6 for a display deviceaccording to another embodiment of the present invention.

The cover window 6 of FIG. 8 is the same as the cover window 5 of FIGS.6 and 7, except that a flat mold layer 41 is further on left and rightedges. Hereinafter, a redundant description will be omitted.

Referring to FIG. 8, the flat mold layer 41 having a smooth surface maybe on the left and right edges of the cover window 6 where the moldlayer 40, the inorganic material pattern layer 50, and the like are notlocated. Because the flat mold layer 41 has a low surface roughness, andthus substantially no pattern is formed on the surface thereof,reflective properties or gloss may not be generated, unlike the moldlayer 40 in which an uneven pattern is formed on the surface thereof.

The flat mold layer 41 may be on the back surface of the film layer 30,and the second print layer 75 may cover the flat mold layer 41.

FIGS. 9 to 14 are sectional views illustrating a process ofmanufacturing the cover window 1 for a display device in a stepwisemanner according to an embodiment of the present invention.

Referring to FIG. 9, first, a film layer 30 is attached to one surfaceof a light-transmitting substrate 10 through an adhesive layer 20. Theplanar area of the light-transmitting substrate 10 may be substantiallythe same as the planar area of the film layer 30.

Referring to FIG. 10, next, a mold layer 40 is formed on the film layer30. Further, In addition, an uneven pattern is formed on the surface ofthe mold layer 40. The surface pattern of the mold layer 40 may beformed separately after the formation of the mold layer 40, or may beformed simultaneously with the formation of the mold layer 40.

In an embodiment, a photocurable resin, which is a material for the moldlayer 40, is applied onto one surface of the film layer 30, a separatemold having a uneven surface was pressed thereon, and then the resin isirradiated with light to cure the resin, thereby forming the mold layer40 having an uneven pattern formed on the surface thereof. However, thepresent invention is not limited thereto.

The mold layer 40 may be formed to cover all of the edges of thelight-transmitting substrate 10, but the present invention is notlimited thereto. In other embodiments, the mold layer 40 may be formedonly on a pair of edges corresponding to each other, as shown in FIG. 6,and the like.

Referring to FIG. 11, next, an inorganic deposition layer 51 is formedto cover the entire surface of the mold layer 40 and the film layer 30.The inorganic deposition layer 51 may be formed by depositing aninorganic material on the mold layer 40 and the film layer 30.

Referring to FIG. 12, a first print layer 60 is formed on the inorganicdeposition layer 51. The first print layer 60 may be formed on a part ofan area where the inorganic deposition layer 51 overlaps the mold layer40. That is, the first print layer 60 may be formed to have a size thatis smaller than that of the mold layer 40 (e.g., smaller by a margin M).

The first print layer 60 may be formed by screen-printing an ink havinga color capable of blocking light on the inorganic deposition layer 51.

Referring to FIG. 13, next, the inorganic deposition layer 51 is etchedusing the first printed layer 60 as a mask. Therefore, the portions ofthe inorganic deposition layer 51 on which the first print layer 60 isnot formed may be removed, so as to form an inorganic material patternlayer 50 covered with the first print layer 60. Further, the surface ofthe mold layer 40 may be exposed by the margin M.

This inorganic material pattern layer 50 may be formed by an NCVMprocess, but the present invention is not limited thereto.

Referring to FIG. 14, next, a second print layer 70 may be formed on theexposed portion of the mold layer 40 so as to form the cover window 1shown in FIGS. 1 and 2. The exposed portion of the mold layer 40 may bein direct contact with the second print layer 70. The second print layer70 may directly cover a part of the first print layer 60 or the filmlayer 30.

The second print layer 70 may be formed by screen-printing an ink havinga color capable of blocking light on the exposed portion of the moldlayer 40.

As described above, according to embodiments of the present invention,the inorganic material pattern layer in the cover window for a displaydevice is formed narrower than the mold layer by a margin or offset, andthe exposed portion of the mold layer is covered with the print layer,thereby preventing a phenomenon in which a golden band is visuallyrecognized or in which visibility is deteriorated in the cover window.

The aspects of embodiments of the present invention are not limited bythe foregoing, and other various effects are anticipated herein.

Although the embodiments of the present invention have been disclosedfor illustrative purposes, those skilled in the art will appreciate thatvarious modifications, additions and substitutions are possible, withoutdeparting from the scope and spirit of the invention as disclosed in theaccompanying claims, with functional equivalents thereof to be included.

What is claimed is:
 1. A method of manufacturing a cover window for adisplay device, comprising: forming a mold layer having an unevenlypatterned surface on at least a part of an edge of a light-transmittingsubstrate; depositing an inorganic material onto the light-transmittingsubstrate to form an inorganic material deposition layer covering theentire surface of the light-transmitting substrate and the mold layer;forming a first print layer on a part of an area where the inorganicmaterial deposition layer overlaps the mold layer; etching the inorganicmaterial deposition layer using the first print layer as a mask to forman inorganic material pattern layer from which a portion where the firstprint layer is not formed is removed; and forming a second print layercovering a portion of the mold layer exposed by removing the inorganicmaterial deposition layer.
 2. The method of claim 1, wherein the firstprint layer and the second print layer are formed by printing an inkhaving a color for substantially blocking visible light.
 3. The methodof claim 1, wherein forming the mold layer comprises irradiating aphotocurable resin with light.
 4. The method of claim 1, wherein themold layer is formed only on a pair of corresponding edges of thelight-transmitting substrate.
 5. The method of claim 4, wherein a moldlayer having a flat surface is on an edge of the light-transmittingsubstrate, the edge not being provided thereon with the mold layer. 6.The method of claim 4, wherein the second print layer is on all edges ofthe light-transmitting substrate.
 7. The method of claim 1, whereinetching the inorganic material deposition layer exposes at least a partof an inner side of the mold layer on a plane.
 8. The method of claim 1,wherein the second print layer covers at least a part of the first printlayer.
 9. The method of claim 8, wherein forming the second print layercomprises completely covering the mold layer, the inorganic materialpattern layer, and the first print layer.